الأهداف الاستهدافية لتفريغ الايونات للفلوريد اللانثانيوم (LaF₃) ST0245

Lanthanum Fluoride (LaF₃) Sputtering Target Description

The Lanthanum Fluoride (LaF₃) Sputtering Target is engineered for precision in thin-film deposition processes. With a purity of ≥99%, it guarantees consistent performance and minimal impurities for high-tech applications. Its versatile shapes, available as discs or custom-made, make it adaptable to various sputtering systems. Crafted with a high melting point of 1493℃ and a density of 5.94 g/cm³, this target is optimized for demanding environments in both research and industrial settings.

Lanthanum Fluoride (LaF₃) Sputtering Target Applications

· Thin-Film Deposition: Essential for semiconductor and display technologies requiring high-quality layer formation.
· Electronic Components: Ideal for fabricating optical coatings and advanced electronic devices.
· Industrial Coatings: Provides robust and durable coatings for a variety of industrial applications.
· Research Applications: Used in laboratories for developing innovative materials and investigating surface phenomena.

Lanthanum Fluoride (LaF₃) Sputtering Target Packing

Our Lanthanum Fluoride (LaF₃) Sputtering Targets are securely packaged to preserve quality during storage and transport. Customized packaging solutions are available to meet specific customer requirements, ensuring the product arrives in pristine condition.

Frequently Asked Questions

Q: What types of applications are best suited for Lanthanum Fluoride (LaF₃) Sputtering Targets?
A: They are highly suitable for semiconductor fabrication, display technology, electronic components, and industrial coating processes.

Q: How does a purity of ≥99% benefit the sputtering process?
A: High purity minimizes contaminants, ensuring consistent thin-film deposition and high-quality performance in advanced applications.

Q: Can the shape of the target be customized for specific sputtering systems?
A: Yes, the target is available in standard disc shapes or can be custom-made to meet unique system requirements.

Q: Is the product capable of withstanding high temperatures during deposition?
A: Absolutely, with a melting point of 1493℃, it is engineered to perform reliably under high-temperature conditions.

Q: What measures are taken to maintain the quality of the targets during packaging?
A: The targets are packaged securely, with options for customized packaging to ensure their integrity is maintained throughout transport and storage.