Gold Tin Alloy Balls (Au80Sn20) Description
Balls exhibit >99% sphericity
(diameter tolerance ±10 μm) and surface roughness <0.1 μm Ra. The eutectic
composition ensures uniform reflow with minimal intermetallic growth. High
thermal conductivity (57 W/m·K) and CTE (14 ppm/°C) match silicon substrates,
reducing thermal stress. Oxygen content <100 ppm prevents oxidation during
reflow. Applications include 5G RF modules, radiation-hardened FPGAs, and
high-brightness LED arrays.
Gold Tin Alloy Balls (Au80Sn20) Applications
·
Gold Tin Alloy Balls (Au80Sn20) are widely
used in high-reliability applications such as microelectronics packaging,
optoelectronic device assembly, laser diode mounting, and hermetic sealing,
where excellent thermal conductivity, mechanical strength, and stable eutectic
bonding are critical.
Gold Tin Alloy Balls (Au80Sn20) Packaging
Our products are packaged in customized cartons of various
sizes based on the material dimensions. Small items are securely packed in PP
boxes, while larger items are placed in custom wooden crates. We ensure strict
adherence to packaging customization and the use of appropriate cushioning
materials to provide optimal protection during transportation.
Packaging: Carton, Wooden Box, or Customized.
Kindly review the packaging
details provided for your reference.
Manufacturing Process
1. Testing Method
(1) Chemical Composition Analysis - Verified using techniques
such as GDMS or XRF to ensure compliance with purity requirements.
(2) Mechanical Properties Testing - Includes tensile strength,
yield strength, and elongation tests to assess material performance.
(3) Dimensional Inspection - Measures thickness, width, and
length to ensure adherence to specified tolerances.
(4) Surface Quality Inspection - Checks for defects such as
scratches, cracks, or inclusions through visual and ultrasonic examination.
(5) Hardness Testing - Determines material hardness to confirm
uniformity and mechanical reliability.
Please refer to the SAM testing procedures for detailed information.
Gold Tin Alloy Balls (Au80Sn20) FAQs
Q1. What are the main applications of Au80Sn20 solder
balls?
Commonly used in microelectronics, optoelectronics, laser
diode packaging, RF components, and hermetic sealing, where high thermal
conductivity and mechanical strength are required.
Q2. What is the melting point of Au80Sn20?
The eutectic melting point is approximately 280°C, providing
a sharp phase transition for clean and reliable soldering.
Q3. What are the advantages of using Au80Sn20 solder
balls?
They offer excellent thermal and electrical conductivity,
corrosion resistance, strong mechanical joints, and compatibility with
sensitive or high-temperature components.
Performance Comparison Table with Competitive Products
|
Property
|
Au80Sn20 Ball
|
SAC305 Ball
|
Sn63Pb37 Ball
|
|
Melting Point (°C)
|
280
|
217-220
|
183
|
|
Shear Strength (MPa)
|
>60
|
35
|
25
|
|
Thermal Cycles (-55-150°C)
|
>1,000
|
500
|
300
|
Related Information
1. Common Preparation Methods
Gold Tin Alloy Balls (Au80Sn20) are typically
produced through a precision melting and atomization process. First,
high-purity gold and tin are melted together in the eutectic ratio (80 wt% Au,
20 wt% Sn) under an inert or vacuum atmosphere to prevent oxidation. The molten
alloy is then rapidly solidified into spherical particles using a gas
atomization or droplet formation technique. For high-precision applications,
further size classification, sieving, and surface treatment (e.g., oxide
removal or passivation) may be performed to ensure uniformity, cleanliness, and
excellent bonding performance.
