اللحام بالأسلاك المصنوعة من سبائك القصدير الذهبية AU6637 (Au80Sn20)

Gold Tin Alloy Paste (Au80Sn20) Description

The paste achieves a slump resistance <5% after 24h and a tack time >4h, enabling precise deposition for fine-pitch components. Reflowed joints show <3% void rates (vs. 10% for SAC305) and thermal resistance <0.15°C/W. The rosin-free formulation eliminates post-reflow cleaning, critical for optical devices. Compatible with nitrogen or forming gas (N₂/H₂) reflow at 280-300°C.

Gold Tin Alloy Paste (Au80Sn20) Applications

·          Optoelectronics: Laser diode attachment, photonic IC assembly.

·          Power Electronics: GaN/SiC die bonding, IGBT modules.

·          Medical: Hermetic sealing of pacemakers, biosensors.

Gold Tin Alloy Paste (Au80Sn20) Packaging

Our products are packaged in customized cartons of various sizes based on the material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We ensure strict adherence to packaging customization and the use of appropriate cushioning materials to provide optimal protection during transportation.

Packaging: Carton, Wooden Box, or Customized.

Kindly review the packaging details provided for your reference.

Manufacturing Process

1.       Testing Method

(1)    Chemical Composition Analysis - Verified using techniques such as GDMS or XRF to ensure compliance with purity requirements.

(2)    Mechanical Properties Testing - Includes tensile strength, yield strength, and elongation tests to assess material performance.

(3)    Dimensional Inspection - Measures thickness, width, and length to ensure adherence to specified tolerances.

(4)    Surface Quality Inspection - Checks for defects such as scratches, cracks, or inclusions through visual and ultrasonic examination.

(5)    Hardness Testing - Determines material hardness to confirm uniformity and mechanical reliability.

Please refer to the SAM testing procedures for detailed information.

Gold Tin Alloy Paste (Au80Sn20) FAQs

Q1. Can this paste be used on copper substrates?

Yes, but requires ENIG or Au plating to prevent Sn oxidation.

Q2. What is the shelf life?

6 months at 5-10°C in sealed containers; avoid freeze-thaw cycles.

Q3. How to optimize stencil printing?

Use stainless steel stencils (100-150 μm thickness) with aperture ratios >1.5.

Performance Comparison Table with Competitive Products

Related Information

1.       Common Preparation Methods

Gold Tin Alloy Solder Paste (Au80Sn20) is typically prepared by first alloying gold and tin in the precise eutectic ratio (80% Au, 20% Sn by weight) through melting and casting, followed by atomization—commonly gas atomization—to produce fine spherical alloy powder. This powder is then mixed with a specially formulated flux and solvent system under controlled conditions to create a homogeneous paste suitable for precision dispensing or printing in microelectronics and optoelectronic assembly.